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313 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

TE CONNECTIVITY AMP CONNECTORS

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
TE CONNECTIVITY AMP CONNECTORS
-
500
Tube
Obsolete
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
25.0µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25.0µin (0.63µm)
Beryllium Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
800
Tube
Obsolete
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
5.00µin (0.127µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
Diplomate DL
Tube
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
15.0µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15.0µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
500
Bulk
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
25.0µin (0.63µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25.0µin (0.63µm)
Copper Alloy
-
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
800
Tube
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
Diplomate DL
Tube
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
15.0µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15.0µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
Diplomate DL
Tube
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
Diplomate DL
Tube
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
15.0µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15.0µin (0.38µm)
Phosphor Bronze
Thermoplastic
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
-
Box
Obsolete
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
8060
Bulk
Obsolete
Transistor, TO-5
4 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
Diplomate DL
Tube
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
-
Bulk
Obsolete
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
-
Tube
Obsolete
PGA
48 (4 x 12)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
-
Tube
Obsolete
QFP
132 (4 x 33)
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-
TE CONNECTIVITY AMP CONNECTORS
-
PKA
Tube
Obsolete
PGA
132 (14 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Phosphor Bronze
Thermoplastic, Polyester, Glass Filled
-
TE CONNECTIVITY AMP CONNECTORS
-
Diplomate DL
Tray
Obsolete
SIP
7 (1 x 7)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
8060
Bag
Obsolete
Transistor, TO-5
4 (Round)
-
Gold
-
Beryllium Copper
Panel Mount
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Fluoropolymer (FP)
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
8058
Bag
Obsolete
Transistor, TO-5
10 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Brass
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
TE CONNECTIVITY AMP CONNECTORS
-
-
Box
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE CONNECTIVITY AMP CONNECTORS
-
-
Box
Obsolete
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin-Lead
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
-
Phosphor Bronze
-
-40°C ~ 105°C
...