Attribute
Description
Manufacturer Part Number
828-AG11D-ESL
Description
CONN IC DIP SOCKET 28POS GOLD
Manufacturer Lead Time
--

Our team will assist you shortly.

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 800
IC Encapsulation Type Tube
Availability Status Obsolete
Device Type Classification DIP, 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 28 (2 x 14)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 5.00µin (0.127µm)
Connecting Pin Material Copper Alloy
Attachment Mounting Style Through Hole
Key Product Highlights Open Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer -
Post Layer Depth -
Solder Tail Material -
Casing Build Material Polyester
Ambient Temp Range -55°C ~ 105°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Emphasizes the thickness of the mating finish denoted as 5.00µin (0.127µm). Utilizes the mating contact material designated as Copper Alloy. Equipped with features categorized as Open Frame. Constructed from Polyester material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 28 (2 x 14) for connector layout. Temperature range -55°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component 800. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.6" (15.24mm) Row Spacing for specifications.