Attribute
Description
Manufacturer Part Number
2-821949-5
Description
CONN SOCKET PQFP 132POS TIN-LEAD
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tube
Availability Status Obsolete
Device Type Classification QFP
Grid Pin Array Count 132 (4 x 33)
Mating Connector Pitch 0.050" (1.27mm)
Engaging Pin Coating Tin-Lead
Engagement Layer Thickness 200.0µin (5.08µm)
Connecting Pin Material Phosphor Bronze
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.050" (1.27mm)
Post-Contact Pin Layer Tin-Lead
Post Layer Depth 200.0µin (5.08µm)
Solder Tail Material Phosphor Bronze
Casing Build Material Liquid Crystal Polymer (LCP)
Ambient Temp Range -

Description

Specifies connector spacing defined as 0.050" (1.27mm) for suitable PCB layout. Offers mating contact finish rated at Tin-Lead. Provides a post-contact finish defined by Tin-Lead. Emphasizes the thickness of the mating finish denoted as 200.0µin (5.08µm). Constructed with the thickness of the post finish evaluated at 200.0µin (5.08µm). Utilizes the mating contact material designated as Phosphor Bronze. Features the post contact material recognized as Phosphor Bronze. Equipped with features categorized as Closed Frame. Constructed from Liquid Crystal Polymer (LCP) material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 132 (4 x 33) for connector layout. Type of housing Tube for safeguarding or transporting components. The distance 0.050" (1.27mm) to achieve correct alignment with the corresponding connector. The space between posts 0.050" (1.27mm) to ensure compatibility with installation or PCB. Product status Obsolete concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections. Type classification QFP for specifications.