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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Box | |
| Availability Status | Obsolete | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 42 (2 x 21) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | 60.0µin (1.52µm) | |
| Connecting Pin Material | Phosphor Bronze | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 60.0µin (1.52µm) | |
| Solder Tail Material | Phosphor Bronze | |
| Casing Build Material | - | |
| Ambient Temp Range | -40°C ~ 105°C |
Description
Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Tin. Provides a post-contact finish defined by Tin. Emphasizes the thickness of the mating finish denoted as 60.0µin (1.52µm). Constructed with the thickness of the post finish evaluated at 60.0µin (1.52µm). Utilizes the mating contact material designated as Phosphor Bronze. Features the post contact material recognized as Phosphor Bronze. Equipped with features categorized as Open Frame. Mounting configuration Through Hole for structural stability. Pins or positions on grid 42 (2 x 21) for connector layout. Temperature range -40°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of housing Box for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Obsolete concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.6" (15.24mm) Row Spacing for specifications.