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51 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

OMRON CORPORATION

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
OMRON CORPORATION
₹151.51
XR2
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹129.94
XR2
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹112.02
XR2
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹15.31
XR2
Bulk
Active
Housing
32 (1 x 32)
0.100" (2.54mm)
-
-
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
-
-
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹134.39
XR2
Bulk
Active
SIP
15 (1 x 15)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹376.40
XR2
Bulk
Active
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹446.86
-
Bulk
Obsolete
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
OMRON CORPORATION
₹323.84
XR2
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹1,171.24
-
Box
Obsolete
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
OMRON CORPORATION
₹219.34
XR2
Bulk
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Threaded
-
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹204.70
XR2
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹402.28
XR2
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹80.18
XR2
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹155.75
XR2
Bulk
Obsolete
Zig-Zag
16 (2 x 8)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹247.42
XR2
Bulk
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹13.79
XR2
Bulk
Obsolete
Housing
20 (1 x 20)
0.100" (2.54mm)
-
-
Beryllium Copper
-
Closed Frame
Solder
0.100" (2.54mm)
-
-
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹160.20
XR2
BulkBox
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹43.70
XR2
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹221.00
XR2
Bulk
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
OMRON CORPORATION
₹471.70
*
Bulk
Obsolete
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-
-
-
-
-
-
-
-
-
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