Attribute
Description
Manufacturer Part Number
XR2A-3201-N
Manufacturer
Description
CONN IC DIP SOCKET 32POS GOLD
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 116

Quantity Unit Price Ext. Price
120 ₹ 323.84000 ₹ 38,860.80
90 ₹ 332.14000 ₹ 29,892.60
60 ₹ 340.88000 ₹ 20,452.80
30 ₹ 350.10000 ₹ 10,503.00
15 ₹ 370.10000 ₹ 5,551.50

Stock:

Distributor: 118


Quantity Unit Price Ext. Price
62 ₹ 337.70000 ₹ 20,937.40
18 ₹ 365.08000 ₹ 6,571.44
1 ₹ 547.62000 ₹ 547.62

Stock:

Distributor: 114


Quantity Unit Price Ext. Price
15 ₹ 431.65000 ₹ 6,474.75
30 ₹ 418.30000 ₹ 12,549.00
90 ₹ 392.49000 ₹ 35,324.10
165 ₹ 380.92000 ₹ 62,851.80
345 ₹ 370.24000 ₹ 1,27,732.80
690 ₹ 359.56000 ₹ 2,48,096.40

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
24 ₹ 563.44000 ₹ 13,522.56

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 574.94000 ₹ 574.94
10 ₹ 474.37000 ₹ 4,743.70
30 ₹ 452.12000 ₹ 13,563.60
60 ₹ 417.41000 ₹ 25,044.60
105 ₹ 402.28000 ₹ 42,239.40
255 ₹ 388.93000 ₹ 99,177.15
510 ₹ 370.24000 ₹ 1,88,822.40

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line XR2
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 32 (2 x 16)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 30.0µin (0.76µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Open Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth 30.0µin (0.76µm)
Solder Tail Material Beryllium Copper
Casing Build Material Polybutylene Terephthalate (PBT), Glass Filled
Ambient Temp Range -55°C ~ 125°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 30.0µin (0.76µm). Constructed with the thickness of the post finish evaluated at 30.0µin (0.76µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Beryllium Copper. Equipped with features categorized as Open Frame. Constructed from Polybutylene Terephthalate (PBT), Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 32 (2 x 16) for connector layout. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component XR2. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.6" (15.24mm) Row Spacing for specifications.