Manufacturer

ARIES ELECTRONICS INC

Part Number	Manufacturer	Price	Product Series Line	IC Encapsulation Type	Availability Status	Device Type Classification	Grid Pin Array Count	Mating Connector Pitch	Engaging Pin Coating	Engagement Layer Thickness	Connecting Pin Material	Attachment Mounting Style	Key Product Highlights	Circuit End Method	Post Pin Interval	Post-Contact Pin Layer	Post Layer Depth	Solder Tail Material	Casing Build Material	Ambient Temp Range
28-6518-10 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹125.49	518	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
04-0513-10T ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹41.45	0513	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
10-2513-10T ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹80.10	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
1109800-14 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹1,358.14	Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
100-PRS10001-12 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹4,506.96	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
40-81150-610C ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹1,655.40	8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-6513-10T ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹75.12	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
07-7XXXX-10 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹445.00	700 Elevator Strip-Line™	Bulk	Active	SIP	7 (1 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
223-PRS18017-12 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹8,780.74	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
01-0518-10 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹18.00	518	Bulk	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-3554-11 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹1,345.68	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 250°C
32-6554-11 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹1,512.11	55	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
24-526-10 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹620.33	Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
28-6554-10 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹807.67	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
40-6554-11 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹2,028.31	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
28-C182-10 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹226.95	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
169-PRS13001-12 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹6,263.82	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
14-0501-21 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹749.38	501	Bulk	Active	SIP	14 (1 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
14-0501-31 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹749.38	501	Bulk	Active	SIP	14 (1 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
08-3518-00 ARIES ELECTRONICS INC	ARIES ELECTRONICS INC	₹69.42	518	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-