Attribute
Description
Manufacturer Part Number
28-C182-10
Manufacturer
Description
CONN IC DIP SOCKET 28POS GOLD
Manufacturer Lead Time
8 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 118

Quantity Unit Price Ext. Price
8 ₹ 226.95000 ₹ 1,815.60
3 ₹ 302.60000 ₹ 907.80
1 ₹ 453.90000 ₹ 453.90

Stock:

Distributor: 110


Quantity Unit Price Ext. Price
5000 ₹ 368.46000 ₹ 18,42,300.00
2500 ₹ 374.69000 ₹ 9,36,725.00
1000 ₹ 384.48000 ₹ 3,84,480.00
500 ₹ 395.16000 ₹ 1,97,580.00
250 ₹ 412.07000 ₹ 1,03,017.50
100 ₹ 430.76000 ₹ 43,076.00
50 ₹ 450.34000 ₹ 22,517.00
5 ₹ 554.47000 ₹ 2,772.35

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
1000 ₹ 390.36000 ₹ 3,90,360.00
500 ₹ 409.90000 ₹ 2,04,950.00
250 ₹ 430.44000 ₹ 1,07,610.00
100 ₹ 459.18000 ₹ 45,918.00
50 ₹ 482.20000 ₹ 24,110.00
25 ₹ 506.37000 ₹ 12,659.25
10 ₹ 540.26000 ₹ 5,402.60
1 ₹ 635.86000 ₹ 635.86

Stock:

Distributor: 127


Quantity Unit Price Ext. Price
400 ₹ 398.72000 ₹ 1,59,488.00
200 ₹ 404.95000 ₹ 80,990.00
120 ₹ 408.51000 ₹ 49,021.20
80 ₹ 411.18000 ₹ 32,894.40
40 ₹ 414.74000 ₹ 16,589.60

Stock:

Distributor: 130


Quantity Unit Price Ext. Price
1 ₹ 588.01000 ₹ 588.01
10 ₹ 499.34000 ₹ 4,993.40
100 ₹ 424.44000 ₹ 42,444.00
250 ₹ 417.02000 ₹ 1,04,255.00
500 ₹ 409.59000 ₹ 2,04,795.00
1000 ₹ 402.17000 ₹ 4,02,170.00

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
2 ₹ 614.99000 ₹ 1,229.98
10 ₹ 523.32000 ₹ 5,233.20
26 ₹ 490.39000 ₹ 12,750.14
50 ₹ 467.25000 ₹ 23,362.50
100 ₹ 444.11000 ₹ 44,411.00
250 ₹ 416.52000 ₹ 1,04,130.00
500 ₹ 395.16000 ₹ 1,97,580.00
1000 ₹ 372.02000 ₹ 3,72,020.00

Stock:

Distributor: 121


Quantity Unit Price Ext. Price
1 ₹ 660.78000 ₹ 660.78
10 ₹ 566.35000 ₹ 5,663.50
26 ₹ 532.35000 ₹ 13,841.10
50 ₹ 508.75000 ₹ 25,437.50
100 ₹ 485.14000 ₹ 48,514.00
250 ₹ 475.18000 ₹ 1,18,795.00

Stock:

Distributor: 113


Quantity Unit Price Ext. Price
69 ₹ 699.01000 ₹ 48,231.69
80 ₹ 695.27000 ₹ 55,621.60
120 ₹ 692.78000 ₹ 83,133.60
160 ₹ 691.53000 ₹ 1,10,644.80
200 ₹ 686.55000 ₹ 1,37,310.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line EJECT-A-DIP™
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 28 (2 x 14)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 10.0µin (0.25µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Tin
Post Layer Depth 200.0µin (5.08µm)
Solder Tail Material Brass
Casing Build Material Polyamide (PA46), Nylon 4/6, Glass Filled
Ambient Temp Range -55°C ~ 105°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Tin. Emphasizes the thickness of the mating finish denoted as 10.0µin (0.25µm). Constructed with the thickness of the post finish evaluated at 200.0µin (5.08µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Brass. Equipped with features categorized as Closed Frame. Constructed from Polyamide (PA46), Nylon 4/6, Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 28 (2 x 14) for connector layout. Temperature range -55°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component EJECT-A-DIP™. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.6" (15.24mm) Row Spacing for specifications.