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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | BERTECH® CFT | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Adhesive Tape Category | Copper Foil | |
| Bonding Agent Type | Acrylic | |
| Support Layer Material | Copper Foil | |
| Material Thickness Gauge | 0.0026" (2.6 mils, 0.066mm) | |
| Adhesive Layer Depth | 0.0013" (1.3 mils, 0.033mm) | |
| Carrier Backing Depth | 0.0013" (1.3 mils, 0.033mm) | |
| Horizontal Width Dimension | 5.50" (139.70mm) 5 1/2" | |
| Linear Length Dimension | 108' (32.9m) 36 yds | |
| Visual Hue | - | |
| Intended Usage Scenario | EMI/RFI Shielding | |
| Operating Temp Limits | 266°F (130°C) |
Description
Applies Acrylic adhesive for strong and lasting bonding. Constructed with Copper Foil backing/carrier materials for durability. Overall length 108' (32.9m) 36 yds for size indication. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component BERTECH® CFT. The category of tape Copper Foil intended for packaging or insulation purposes. The temperature limits 266°F (130°C) for safe operation. Measurement of thickness 0.0026" (2.6 mils, 0.066mm) for material or component dimensions. Thickness of the adhesive layer 0.0013" (1.3 mils, 0.033mm) meant for bonding applications. Thickness of the backing or carrier 0.0013" (1.3 mils, 0.033mm) used for tape or film. Application EMI/RFI Shielding for defined purpose or objective. Horizontal width measurement 5.50" (139.70mm) 5 1/2".
