Attribute
Description
Manufacturer Part Number
WBNCSAC20
Description
LEAD FREE NO-CLEAN FLUX CORE SIL
Manufacturer Lead Time
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Stock:

Distributor: 117

Quantity Unit Price Ext. Price
1 ₹ 8,791.18000 ₹ 8,791.18

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Spool
Availability Status Active
Device Type Classification Wire Solder
Material Blend Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Circular Measurement 0.020" (0.51mm)
Fusion Temperature 430°F (221°C)
Solder Flux Category No-Clean
AWG Wire Size 24 AWG, 25 SWG
Filter Mesh Design -
Manufacturing Process Type Lead Free
Physical Form Factor Spool, 1 lb (454 g)
Storage Duration Limit -
Expiration Start Date -
Cool Storage Temp Range -

Description

Made from a combination of substances referred to as Sn96.5Ag3Cu0.5 (96.5/3/0.5). Offers diameter noted at 0.020" (0.51mm). Makes use of a flux type referred to as No-Clean. Utilizes a form factor outlined as Spool, 1 lb (454 g). Melting point 430°F (221°C) for thermal and material stability. Type of housing Spool for safeguarding or transporting components. Category of process Lead Free for production or operational relevance. Product status Active concerning availability and lifecycle. Type classification Wire Solder for specifications. Size of wire gauge 24 AWG, 25 SWG according to electrical standards.