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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Bi57Sn42Ag1 (57/42/1) | |
| Circular Measurement | - | |
| Fusion Temperature | 279°F (137°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | 5 | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Jar, 8.8 oz (250g) | |
| Storage Duration Limit | 12 Months | |
| Expiration Start Date | Date of Manufacture | |
| Cool Storage Temp Range | 37°F ~ 46°F (3°C ~ 8°C) |
Description
Made from a combination of substances referred to as Bi57Sn42Ag1 (57/42/1). Makes use of a flux type referred to as No-Clean. Utilizes a form factor outlined as Jar, 8.8 oz (250g). Melting point 279°F (137°C) for thermal and material stability. Mesh type 5 tailored for specific material or airflow needs. Type of housing Bag for safeguarding or transporting components. Category of process Lead Free for production or operational relevance. Product status Active concerning availability and lifecycle. Duration of product life 12 Months for durability. Start of the shelf life Date of Manufacture for monitoring storage. Temperature range 37°F ~ 46°F (3°C ~ 8°C) for storage or refrigeration to maintain material integrity. Type classification Solder Paste for specifications.
