Attribute
Description
Manufacturer Part Number
SSLFWS-T5-250G
Description
SOLDER PASTE WATER SOLUBLE SAC30
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bag
Availability Status Active
Device Type Classification Solder Paste
Material Blend Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Circular Measurement -
Fusion Temperature -
Solder Flux Category No-Clean, Water Soluble
AWG Wire Size -
Filter Mesh Design 5
Manufacturing Process Type -
Physical Form Factor Jar, 8.8 oz (250g)
Storage Duration Limit 12 Months
Expiration Start Date Date of Manufacture
Cool Storage Temp Range 37°F ~ 42°F (3°C ~ 6°C)

Description

Made from a combination of substances referred to as Sn96.5Ag3Cu0.5 (96.5/3/0.5). Makes use of a flux type referred to as No-Clean, Water Soluble. Utilizes a form factor outlined as Jar, 8.8 oz (250g). Mesh type 5 tailored for specific material or airflow needs. Type of housing Bag for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Duration of product life 12 Months for durability. Start of the shelf life Date of Manufacture for monitoring storage. Temperature range 37°F ~ 42°F (3°C ~ 6°C) for storage or refrigeration to maintain material integrity. Type classification Solder Paste for specifications.