Attribute
Description
Manufacturer Part Number
OS-S031
Manufacturer
Description
SOLDER NO-CLEAN .031" X 20'
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Wire Solder | |
| Material Blend | Sn63Pb37 (63/37) | |
| Circular Measurement | 0.031" (0.79mm) | |
| Fusion Temperature | 361°F (183°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | 20 AWG, 22 SWG | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Leaded | |
| Physical Form Factor | Spool | |
| Storage Duration Limit | - | |
| Expiration Start Date | - | |
| Cool Storage Temp Range | - |
Description
Made from a combination of substances referred to as Sn63Pb37 (63/37). Offers diameter noted at 0.031" (0.79mm). Makes use of a flux type referred to as No-Clean. Utilizes a form factor outlined as Spool. Melting point 361°F (183°C) for thermal and material stability. Type of housing Bulk for safeguarding or transporting components. Category of process Leaded for production or operational relevance. Product status Obsolete concerning availability and lifecycle. Type classification Wire Solder for specifications. Size of wire gauge 20 AWG, 22 SWG according to electrical standards.
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