Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 120 | ₹ 3,621.56000 | ₹ 4,34,587.20 |
| 80 | ₹ 3,761.50000 | ₹ 3,00,920.00 |
| 40 | ₹ 4,012.65000 | ₹ 1,60,506.00 |
| 10 | ₹ 4,564.00000 | ₹ 45,640.00 |
| 5 | ₹ 4,866.47000 | ₹ 24,332.35 |
| 1 | ₹ 5,647.18000 | ₹ 5,647.18 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | C400 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Wire Solder | |
| Material Blend | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Circular Measurement | 0.022" (0.56mm) | |
| Fusion Temperature | 423°F (217°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | 23 AWG, 24 SWG | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Spool, 8.8 oz (250g) | |
| Storage Duration Limit | - | |
| Expiration Start Date | - | |
| Cool Storage Temp Range | 59°F ~ 86°F (15°C ~ 30°C) |
Description
Made from a combination of substances referred to as Sn96.5Ag3Cu0.5 (96.5/3/0.5). Offers diameter noted at 0.022" (0.56mm). Makes use of a flux type referred to as No-Clean. Utilizes a form factor outlined as Spool, 8.8 oz (250g). Melting point 423°F (217°C) for thermal and material stability. Type of housing Bulk for safeguarding or transporting components. Category of process Lead Free for production or operational relevance. Product status Active concerning availability and lifecycle. Classification series for the product or component C400. Temperature range 59°F ~ 86°F (15°C ~ 30°C) for storage or refrigeration to maintain material integrity. Type classification Wire Solder for specifications. Size of wire gauge 23 AWG, 24 SWG according to electrical standards.
