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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | LOCTITE® GC 18 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Circular Measurement | - | |
| Fusion Temperature | 423°F (217°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | - | |
| Storage Duration Limit | 6 Months | |
| Expiration Start Date | Date of Manufacture | |
| Cool Storage Temp Range | 41°F ~ 77°F (5°C ~ 25°C) |
Description
Made from a combination of substances referred to as Sn96.5Ag3Cu0.5 (96.5/3/0.5). Makes use of a flux type referred to as No-Clean. Melting point 423°F (217°C) for thermal and material stability. Type of housing Bulk for safeguarding or transporting components. Category of process Lead Free for production or operational relevance. Product status Active concerning availability and lifecycle. Classification series for the product or component LOCTITE® GC 18. Duration of product life 6 Months for durability. Start of the shelf life Date of Manufacture for monitoring storage. Temperature range 41°F ~ 77°F (5°C ~ 25°C) for storage or refrigeration to maintain material integrity. Type classification Solder Paste for specifications.
