Attribute
Description
Manufacturer Part Number
17555LF
Manufacturer
Description
SOLDER 100G 1.0MM LEAD FREE
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Spool
Availability Status Obsolete
Device Type Classification Wire Solder
Material Blend Sn99.3Cu0.7 (99.3/0.7)
Circular Measurement 0.039" (0.99mm)
Fusion Temperature 440°F (227°C)
Solder Flux Category Rosin Activated (RA)
AWG Wire Size 18 AWG, 19 SWG
Filter Mesh Design -
Manufacturing Process Type Lead Free
Physical Form Factor Spool, 3.53 oz (100g)
Storage Duration Limit -
Expiration Start Date -
Cool Storage Temp Range -

Description

Made from a combination of substances referred to as Sn99.3Cu0.7 (99.3/0.7). Offers diameter noted at 0.039" (0.99mm). Makes use of a flux type referred to as Rosin Activated (RA). Utilizes a form factor outlined as Spool, 3.53 oz (100g). Melting point 440°F (227°C) for thermal and material stability. Type of housing Spool for safeguarding or transporting components. Category of process Lead Free for production or operational relevance. Product status Obsolete concerning availability and lifecycle. Type classification Wire Solder for specifications. Size of wire gauge 18 AWG, 19 SWG according to electrical standards.