Attribute
Description
Manufacturer Part Number
5897
Description
MINI LEADED SOLDER SPOOL - 0.8MM
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Wire Solder
Material Blend Sn63Pb37 (63/37)
Circular Measurement 0.031" (0.79mm)
Fusion Temperature -
Solder Flux Category -
AWG Wire Size -
Filter Mesh Design -
Manufacturing Process Type Leaded
Physical Form Factor Bar
Storage Duration Limit -
Expiration Start Date -
Cool Storage Temp Range -

Description

Made from a combination of substances referred to as Sn63Pb37 (63/37). Offers diameter noted at 0.031" (0.79mm). Utilizes a form factor outlined as Bar. Type of housing Bulk for safeguarding or transporting components. Category of process Leaded for production or operational relevance. Product status Active concerning availability and lifecycle. Type classification Wire Solder for specifications.