Attribute
Description
Manufacturer Part Number
TSPS803H2002BUF
Description
THIN FILM RES THROUGH HOLE SINGL
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 116

Quantity Unit Price Ext. Price
1000 ₹ 520.33000 ₹ 5,20,330.00
500 ₹ 523.04000 ₹ 2,61,520.00
210 ₹ 525.75000 ₹ 1,10,407.50
110 ₹ 528.46000 ₹ 58,130.60
100 ₹ 602.69000 ₹ 60,269.00

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 906.91000 ₹ 906.91
10 ₹ 751.16000 ₹ 7,511.60
25 ₹ 694.20000 ₹ 17,355.00
50 ₹ 660.38000 ₹ 33,019.00
100 ₹ 617.66000 ₹ 61,766.00
250 ₹ 574.94000 ₹ 1,43,735.00
500 ₹ 558.03000 ₹ 2,79,015.00
1000 ₹ 542.01000 ₹ 5,42,010.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line TSP
IC Encapsulation Type Tube
Availability Status Active
Circuit Configuration Style Isolated
Ohm Value Specification 20k
Accuracy Tolerance Percentage ±0.1%
Resistor Component Total 4
Resistor Pair Balance ±0.1%
Ratio Stability Over Time ±2ppm/°C
IC Pin Total 8
Wattage per Component 100mW
Temp Drift Factor ±50ppm/°C
Ambient Temp Range -55°C ~ 125°C
Quality Grade Level -
Certification Qualification -
Intended Uses -
Attachment Mounting Style Through Hole
Component Housing Style 8-SIP
Vendor Package Type -
Package Size Specs 0.783" L x 0.095" W (19.89mm x 2.41mm)
Maximum Mounted Height 0.197" (5.00mm)

Description

Employs a circuit variation identified as Isolated. Maximum installed height of 0.197" (5.00mm) for components affixed to the board. Mounting configuration Through Hole for structural stability. Overall number of pins 8 for connectors or integrated circuits. Overall total of resistors 4 for circuit design purposes. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 8-SIP that offers mechanical and thermal protection. Energy per unit 100mW for evaluating modular systems. Product status Active concerning availability and lifecycle. Ohmic resistance value 20k for accurate electrical information. The alignment ratio of resistors ±0.1% for circuits requiring high precision. Variation in resistor ratio ±2ppm/°C to maintain temperature uniformity. Classification series for the product or component TSP. Details on package size 0.783" L x 0.095" W (19.89mm x 2.41mm) for electrical or mechanical components. Measurement dimensions 0.783" L x 0.095" W (19.89mm x 2.41mm) for component specifications. The temperature drift factor ±50ppm/°C that guarantees performance consistency. Precision tolerance level ±0.1% in manufacturing processes.