Description

Employs a circuit variation identified as Isolated. Maximum installed height of 0.043" (1.10mm) for components affixed to the board. Mounting configuration Surface Mount for structural stability. Overall number of pins 8 for connectors or integrated circuits. Overall total of resistors 4 for circuit design purposes. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) that offers mechanical and thermal protection. Type of package 8-MSOP that preserves the integrity of the device. Energy per unit 50mW for evaluating modular systems. Product status Active concerning availability and lifecycle. Ohmic resistance value 1k for accurate electrical information. The alignment ratio of resistors ±0.05% for circuits requiring high precision. Variation in resistor ratio ±1ppm/°C to maintain temperature uniformity. Classification series for the product or component MORN. Details on package size 0.118" L x 0.118" W (3.00mm x 3.00mm) for electrical or mechanical components. Measurement dimensions 0.118" L x 0.118" W (3.00mm x 3.00mm) for component specifications. Supplier package type 8-MSOP for component selection. The temperature drift factor ±25ppm/°C that guarantees performance consistency. Precision tolerance level ±0.1% in manufacturing processes.