Stock:
Distributor: 109
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10 | ₹ 11,102.75000 | ₹ 1,11,027.50 |
| 1 | ₹ 12,336.29000 | ₹ 12,336.29 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HCF | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Ohm Resistance Value | 6.8 Ohms | |
| Accuracy Tolerance Percentage | ±5% | |
| Wattage Power Level | 100W | |
| Material Blend | Wirewound | |
| Temp Drift Factor | ±200ppm/°C | |
| Ambient Temp Range | 260°C | |
| Key Product Highlights | - | |
| Protective Enclosure Finish | Aluminum | |
| Installation Mount Type | Screw Holes | |
| Package Size Specs | 4.331" L x 2.992" W (110.00mm x 76.00mm) | |
| Maximum Mounted Height | 0.591" (15.00mm) | |
| Wire Lead Configuration | - | |
| Component Housing Style | Module | |
| Reliability Failure Metric | - | |
| Quality Grade Level | - | |
| Certification Qualification | - |
Description
The enclosure is finished with a protective coating type rated Aluminum. Made from a combination of substances referred to as Wirewound. Maximum installed height of 0.591" (15.00mm) for components affixed to the board. Type of mount Screw Holes for easy installation. Temperature range 260°C for environmental conditions impacting thermal efficiency. Type of housing Box for safeguarding or transporting components. Style of the enclosure/case Module that offers mechanical and thermal protection. Power measured in watts 100W for optimal operation. Product status Active concerning availability and lifecycle. Resistance value 6.8 Ohms for electrical performance. Classification series for the product or component HCF. Details on package size 4.331" L x 2.992" W (110.00mm x 76.00mm) for electrical or mechanical components. Measurement dimensions 4.331" L x 2.992" W (110.00mm x 76.00mm) for component specifications. The temperature drift factor ±200ppm/°C that guarantees performance consistency. Precision tolerance level ±5% in manufacturing processes.
