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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | i.MX 9 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Central CPU Unit | ARM® Cortex®-A55, ARM® Cortex®-M33 | |
| Operational Speed Rating | 250MHz, 1.7GHz | |
| Processor Core Number | 5 | |
| Wattage Power Level | - | |
| Thermal Management Method | - | |
| Package Size Specs | 3.228" L x 1.969" W (82.00mm x 50.00mm) | |
| Device Size Standard | SMARC v2.1.1 | |
| Expansion Slot Bus Type | - | |
| Installed RAM Volume | 4GB/4GB | |
| Memory Bus Interface | eMMC Flash, LPDDR4 | |
| Display Video Ports | HDMI, LVDS, MIPI DSI | |
| Network Ethernet Standard | - | |
| USB Interface Version | USB 2.0 (1), USB 2.0 OTG (1), USB 3.0 (2) | |
| Serial Port Standards | - | |
| Digital Input/Output Pins | - | |
| Analog Signal In to Out | - | |
| System Monitor Timer | - | |
| Included Components | - | |
| Ambient Temp Range | 0°C ~ 70°C |
Description
Includes the core processor identified as ARM® Cortex®-A55, ARM® Cortex®-M33 for swift processing. Shows a form factor labeled as SMARC v2.1.1. The total number of cores is 5 for processors or cables. Temperature range 0°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Product status Active concerning availability and lifecycle. The total capacity of the installed RAM 4GB/4GB for optimal computing performance. Classification series for the product or component i.MX 9. Details on package size 3.228" L x 1.969" W (82.00mm x 50.00mm) for electrical or mechanical components. Measurement dimensions 3.228" L x 1.969" W (82.00mm x 50.00mm) for component specifications. Operational speed 250MHz, 1.7GHz for mechanical or data tasks. Connection interface eMMC Flash, LPDDR4 for storage integration. Version of USB USB 2.0 (1), USB 2.0 OTG (1), USB 3.0 (2) for connectivity. Video interfaces HDMI, LVDS, MIPI DSI for display or graphics output.
