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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Proximity Detection Range | 0.118" (3mm) | |
| Detection Technology Type | Through-Beam | |
| Output Setup Options | Phototransistor | |
| Max Forward DC Current | 60 mA | |
| Maximum Collector Amps | - | |
| Max Collector-Emitter Breakdown | 30 V | |
| Activation Speed ms | 5µs, 5µs | |
| Ambient Temp Range | -55°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Through Hole, Flange | |
| Component Housing Style | Slotted, PC Pins |
Description
Offers a maximum DC forward current (If) specified at 60 mA. Mounting configuration Through Hole, Flange for structural stability. Temperature range -55°C ~ 85°C for environmental conditions impacting thermal efficiency. Preferences Phototransistor for establishing system output configurations. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Slotted, PC Pins that offers mechanical and thermal protection. Product status Obsolete concerning availability and lifecycle. Time taken to respond 5µs, 5µs for rapid operation or detection. Sensor detection range 0.118" (3mm) for sensors or detectors. Method of detection Through-Beam for device operation. Maximum collector-emitter breakdown voltage 30 V.
