Description

Operates within a frequency spectrum of 3.3 MHz ~ 170 MHz. Incorporates a MEMS base resonator to maintain stable frequency control. Manages the maximum supply current noted as 35mA. Ensures ±25ppm frequency dependability for reliable performance. Engineered with Standby (Power Down) features for versatile component usage. Maximum installed height of 0.035" (0.90mm) for components affixed to the board. Mounting configuration Surface Mount for structural stability. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Output format CMOS for electrical or signal communication. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 6-VDFN Exposed Pad that offers mechanical and thermal protection. Type of package 6-VDFN (7x5) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Adjustable type Blank (User Must Program) for device configuration. Classification series for the product or component DSC1101. Details on package size 0.276" L x 0.197" W (7.00mm x 5.00mm) for electrical or mechanical components. Measurement dimensions 0.276" L x 0.197" W (7.00mm x 5.00mm) for component specifications. Supplier package type 6-VDFN (7x5) for component selection. Voltage requirement 2.25V ~ 3.6V for electrical specifications. Type classification XO (Standard) for specifications. Voltage supply 2.25V ~ 3.6V for device operation.