Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 56 | ₹ 8,865.29000 | ₹ 4,96,456.24 |
| 28 | ₹ 9,000.57000 | ₹ 2,52,015.96 |
| 21 | ₹ 9,137.63000 | ₹ 1,91,890.23 |
| 14 | ₹ 9,277.36000 | ₹ 1,29,883.04 |
| 7 | ₹ 9,814.92000 | ₹ 68,704.44 |
| 1 | ₹ 10,922.97000 | ₹ 10,922.97 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 14 | ₹ 9,913.71000 | ₹ 1,38,791.94 |
| 28 | ₹ 9,827.38000 | ₹ 2,75,166.64 |
| 56 | ₹ 9,741.94000 | ₹ 5,45,548.64 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 7 | ₹ 11,255.03000 | ₹ 78,785.21 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 55 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 36 (2 x 18) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Nickel Boron | |
| Engagement Layer Thickness | 50.0µin (1.27µm) | |
| Connecting Pin Material | Beryllium Nickel | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Nickel Boron | |
| Post Layer Depth | 50.0µin (1.27µm) | |
| Solder Tail Material | Beryllium Nickel | |
| Casing Build Material | Polyetheretherketone (PEEK), Glass Filled | |
| Ambient Temp Range | -55°C ~ 250°C |
Description
Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Nickel Boron. Provides a post-contact finish defined by Nickel Boron. Emphasizes the thickness of the mating finish denoted as 50.0µin (1.27µm). Constructed with the thickness of the post finish evaluated at 50.0µin (1.27µm). Utilizes the mating contact material designated as Beryllium Nickel. Features the post contact material recognized as Beryllium Nickel. Equipped with features categorized as Closed Frame. Constructed from Polyetheretherketone (PEEK), Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 36 (2 x 18) for connector layout. Temperature range -55°C ~ 250°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component 55. Termination method Solder for electrical or mechanical connections. Type classification DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing for specifications.