Attribute
Description
Manufacturer Part Number
IXDP630PI
Manufacturer
Description
--
Manufacturer Lead Time
38 weeks
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| User Interface Type | Microprocessor | |
| Single/Dual (±) | 4.5 V ~ 5.5 V | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | 18-DIP (0.300", 7.62mm) |
Description
Assesses resistance at forward current Microprocessor for LED or diode testing. Designed for Microprocessor ease of use and user interaction. Mounting configuration Through Hole for structural stability. Style of the enclosure/case 18-DIP (0.300", 7.62mm) that offers mechanical and thermal protection.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD