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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Driver | |
| Communication Standard | LVDS | |
| Transceiver Pair Count | 2/0 | |
| Full/Half Duplex Mode | - | |
| Input Hysteresis Voltage | - | |
| Transfer Speed Mbps | 600Mbps | |
| Power Supply Voltage | 3V ~ 3.6V | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 8-VFSOP (0.091", 2.30mm Width) | |
| Vendor Package Type | US8 |
Description
Delivers a data transfer rate measured at 600Mbps for rapid operations. Demonstrates a sampling rate capability indicated as 600Mbps. Mounting configuration Surface Mount for structural stability. Total drivers/receivers 2/0 employed in communication or signaling tasks. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 8-VFSOP (0.091", 2.30mm Width) that offers mechanical and thermal protection. Type of package US8 that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Protocol for communication LVDS for control or interaction. Supplier package type US8 for component selection. Voltage requirement 3V ~ 3.6V for electrical specifications. Type classification Driver for specifications. Voltage supply 3V ~ 3.6V for device operation.
