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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | Telecom Circuit | |
| User Interface Type | TDM | |
| Electrical Circuit Count | 1 | |
| Power Supply Voltage | 1.65V ~ 1.95V | |
| Power Supply Amperage | 950mA | |
| Wattage Power Level | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 324-BGA | |
| Vendor Package Type | 324-PBGA (23x23) |
Description
Employs supply current defined as 950mA. Engineered with Telecom Circuit features for versatile component usage. Designed for TDM ease of use and user interaction. Mounting configuration Surface Mount for structural stability. The total number of circuits stands at 1 for electrical or electronic setups. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 324-BGA that offers mechanical and thermal protection. Type of package 324-PBGA (23x23) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 324-PBGA (23x23) for component selection. Voltage requirement 1.65V ~ 1.95V for electrical specifications. Voltage supply 1.65V ~ 1.95V for device operation.
