Description

Mounting configuration Surface Mount for structural stability. The total number of circuits stands at 4 for electrical or electronic setups. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 256-BGA Exposed Pad that offers mechanical and thermal protection. Type of package 256-L2BGA (27x27) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component HOTlink II™. Supplier package type 256-L2BGA (27x27) for component selection. Voltage requirement 3.135V ~ 3.465V for electrical specifications. Voltage supply 3.135V ~ 3.465V for device operation.