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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HOTlink II™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | Transceiver | |
| User Interface Type | LVTTL | |
| Electrical Circuit Count | 2 | |
| Power Supply Voltage | 3.135V ~ 3.465V | |
| Power Supply Amperage | 570mA | |
| Wattage Power Level | - | |
| Ambient Temp Range | 0°C ~ 70°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 196-LBGA | |
| Vendor Package Type | 196-FBGA (15x15) |
Description
Employs supply current defined as 570mA. Engineered with Transceiver features for versatile component usage. Designed for LVTTL ease of use and user interaction. Mounting configuration Surface Mount for structural stability. The total number of circuits stands at 2 for electrical or electronic setups. Temperature range 0°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 196-LBGA that offers mechanical and thermal protection. Type of package 196-FBGA (15x15) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component HOTlink II™. Supplier package type 196-FBGA (15x15) for component selection. Voltage requirement 3.135V ~ 3.465V for electrical specifications. Voltage supply 3.135V ~ 3.465V for device operation.
