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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HOTlink II™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | - | |
| User Interface Type | LVTTL | |
| Electrical Circuit Count | 4 | |
| Power Supply Voltage | 3.135V ~ 3.465V | |
| Power Supply Amperage | 830mA | |
| Wattage Power Level | - | |
| Ambient Temp Range | 0°C ~ 70°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 256-BGA Exposed Pad | |
| Vendor Package Type | 256-L2BGA (27x27) |
Description
Employs supply current defined as 830mA. Designed for LVTTL ease of use and user interaction. Mounting configuration Surface Mount for structural stability. The total number of circuits stands at 4 for electrical or electronic setups. Temperature range 0°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 256-BGA Exposed Pad that offers mechanical and thermal protection. Type of package 256-L2BGA (27x27) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component HOTlink II™. Supplier package type 256-L2BGA (27x27) for component selection. Voltage requirement 3.135V ~ 3.465V for electrical specifications. Voltage supply 3.135V ~ 3.465V for device operation.
