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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | TDM-over-Packet (TDMoP) | |
| User Interface Type | TDMoP | |
| Electrical Circuit Count | 1 | |
| Power Supply Voltage | 1.8V, 3.3V | |
| Power Supply Amperage | - | |
| Wattage Power Level | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 676-BGA | |
| Vendor Package Type | 676-TEPBGA (27x27) |
Description
Engineered with TDM-over-Packet (TDMoP) features for versatile component usage. Designed for TDMoP ease of use and user interaction. Mounting configuration Surface Mount for structural stability. The total number of circuits stands at 1 for electrical or electronic setups. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 676-BGA that offers mechanical and thermal protection. Type of package 676-TEPBGA (27x27) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 676-TEPBGA (27x27) for component selection. Voltage requirement 1.8V, 3.3V for electrical specifications. Voltage supply 1.8V, 3.3V for device operation.
