Attribute
Description
Manufacturer Part Number
TDA4VM88TGBALFR
Manufacturer
Description
NEXT GENERATION SOC FAMILY FOR L
Manufacturer Lead Time
53 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
250 ₹ 11,679.04000 ₹ 29,19,760.00
25 ₹ 12,622.67000 ₹ 3,15,566.75
10 ₹ 13,204.33000 ₹ 1,32,043.30
1 ₹ 15,534.19000 ₹ 15,534.19

Stock:

Distributor: 145


Quantity Unit Price Ext. Price
2 ₹ 16,069.45000 ₹ 32,138.90
1 ₹ 17,923.61000 ₹ 17,923.61

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Availability Status Obsolete
System Design Structure DSP, MCU, MPU
Central CPU Unit ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Non-Volatile Flash Memory -
Random Access Memory Bytes 1.5MB
External Device Support DMA, PWM, WDT
Interconnect Options MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Operational Speed Rating 2GHz, 1GHz, 1.35GHz, 1GHz
Key Feature Specifications -
Ambient Temp Range -40°C ~ 105°C (TJ)
Quality Grade Level Automotive
Certification Qualification AEC-Q100
Component Housing Style 827-BFBGA, FCBGA
Vendor Package Type 827-FCBGA (24x24)

Description

Utilizes a DSP, MCU, MPU architecture to improve effectiveness. Presents connection choices defined by MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x for swift processing. Evaluated as Automotive grade for quality control. Temperature range -40°C ~ 105°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 827-BFBGA, FCBGA that offers mechanical and thermal protection. Type of package 827-FCBGA (24x24) that preserves the integrity of the device. Support for external devices DMA, PWM, WDT for system integration and improvement. Product status Obsolete concerning availability and lifecycle. Certification AEC-Q100 for compliance with testing or regulatory standards. The total size of RAM 1.5MB for system or device specifications. Operational speed 2GHz, 1GHz, 1.35GHz, 1GHz for mechanical or data tasks. Supplier package type 827-FCBGA (24x24) for component selection.