Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 250 | ₹ 7,102.45000 | ₹ 17,75,612.50 |
| 100 | ₹ 7,884.12000 | ₹ 7,88,412.00 |
| 25 | ₹ 8,338.01000 | ₹ 2,08,450.25 |
| 10 | ₹ 8,750.99000 | ₹ 87,509.90 |
| 1 | ₹ 10,405.65000 | ₹ 10,405.65 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 10,446.82000 | ₹ 10,446.82 |
| 10 | ₹ 8,773.62000 | ₹ 87,736.20 |
| 25 | ₹ 8,355.32000 | ₹ 2,08,883.00 |
| 100 | ₹ 7,896.97000 | ₹ 7,89,697.00 |
| 250 | ₹ 7,678.03000 | ₹ 19,19,507.50 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® | |
| Availability Status | Active | |
| System Design Structure | DSP, MCU, MPU | |
| Central CPU Unit | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | |
| Non-Volatile Flash Memory | - | |
| Random Access Memory Bytes | 1.5MB | |
| External Device Support | DMA, PWM, WDT | |
| Interconnect Options | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | |
| Operational Speed Rating | 2GHz, 1GHz, 1GHz | |
| Key Feature Specifications | - | |
| Ambient Temp Range | -40°C ~ 125°C (TJ) | |
| Quality Grade Level | Automotive | |
| Certification Qualification | AEC-Q100 | |
| Component Housing Style | 770-BFBGA, FCBGA | |
| Vendor Package Type | 770-FCBGA (23x23) |
Description
Utilizes a DSP, MCU, MPU architecture to improve effectiveness. Presents connection choices defined by MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x for swift processing. Evaluated as Automotive grade for quality control. Temperature range -40°C ~ 125°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 770-BFBGA, FCBGA that offers mechanical and thermal protection. Type of package 770-FCBGA (23x23) that preserves the integrity of the device. Support for external devices DMA, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Certification AEC-Q100 for compliance with testing or regulatory standards. The total size of RAM 1.5MB for system or device specifications. Operational speed 2GHz, 1GHz, 1GHz for mechanical or data tasks. Supplier package type 770-FCBGA (23x23) for component selection.
