Utilizes a DSP, MPU architecture to improve effectiveness. Presents connection choices defined by CAN, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-M4, C66x for swift processing. Temperature range -40°C ~ 125°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 367-BFBGA, FCBGA that offers mechanical and thermal protection. Type of package 367-FCBGA (15x15) that preserves the integrity of the device. Support for external devices DMA, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. The total size of RAM 512kB for system or device specifications. Operational speed 212.8MHz, 745MHz for mechanical or data tasks. Supplier package type 367-FCBGA (15x15) for component selection.
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