Description

Utilizes a MPU architecture to improve effectiveness. Presents connection choices defined by AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART for seamless integration. Includes the core processor identified as ARM® Cortex®-A53, ARM® Cortex®-M7 for swift processing. Temperature range 0°C ~ 95°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 306-TFBGA that offers mechanical and thermal protection. Type of package 306-TFBGA (11x11) that preserves the integrity of the device. Support for external devices DMA, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. The total size of RAM 544KB for system or device specifications. Classification series for the product or component i.MX8MN. Operational speed 1.4GHz, 750MHz for mechanical or data tasks. Supplier package type 306-TFBGA (11x11) for component selection.