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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | SmartFusion®2 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | ARM® Cortex®-M3 | |
| Non-Volatile Flash Memory | 256KB | |
| Random Access Memory Bytes | 64KB | |
| External Device Support | DDR, PCIe, SERDES | |
| Interconnect Options | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |
| Operational Speed Rating | 166MHz | |
| Key Feature Specifications | FPGA - 50K Logic Modules | |
| Ambient Temp Range | -40°C ~ 100°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 896-BGA | |
| Vendor Package Type | 896-FBGA (31x31) |
Description
Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by CANbus, Ethernet, I2C, SPI, UART/USART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Indicates flash memory size evaluated at 256KB. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 896-BGA that offers mechanical and thermal protection. Type of package 896-FBGA (31x31) that preserves the integrity of the device. Support for external devices DDR, PCIe, SERDES for system integration and improvement. Essential attributes FPGA - 50K Logic Modules detailing main features. Product status Obsolete concerning availability and lifecycle. The total size of RAM 64KB for system or device specifications. Classification series for the product or component SmartFusion®2. Operational speed 166MHz for mechanical or data tasks. Supplier package type 896-FBGA (31x31) for component selection.
