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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | SmartFusion® | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | ARM® Cortex®-M3 | |
| Non-Volatile Flash Memory | 128KB | |
| Random Access Memory Bytes | 16KB | |
| External Device Support | DMA, POR, WDT | |
| Interconnect Options | EBI/EMI, I2C, SPI, UART/USART | |
| Operational Speed Rating | 80MHz | |
| Key Feature Specifications | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |
| Ambient Temp Range | -55°C ~ 125°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 256-LBGA | |
| Vendor Package Type | 256-FPBGA (17x17) |
Description
Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by EBI/EMI, I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Indicates flash memory size evaluated at 128KB. Temperature range -55°C ~ 125°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 256-LBGA that offers mechanical and thermal protection. Type of package 256-FPBGA (17x17) that preserves the integrity of the device. Support for external devices DMA, POR, WDT for system integration and improvement. Essential attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops detailing main features. Product status Obsolete concerning availability and lifecycle. The total size of RAM 16KB for system or device specifications. Classification series for the product or component SmartFusion®. Operational speed 80MHz for mechanical or data tasks. Supplier package type 256-FPBGA (17x17) for component selection.
