Attribute
Description
Manufacturer Part Number
A2F500M3G-FGG484
Description
IC SOC CORTEX-M3 80MHZ 484FBGA
Manufacturer Lead Time
34 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 140

Quantity Unit Price Ext. Price
5000 ₹ 4,611.98000 ₹ 2,30,59,900.00
1000 ₹ 4,773.96000 ₹ 47,73,960.00
500 ₹ 7,390.56000 ₹ 36,95,280.00
250 ₹ 7,599.71000 ₹ 18,99,927.50
50 ₹ 7,817.76000 ₹ 3,90,888.00
1 ₹ 7,934.35000 ₹ 7,934.35

Stock:

Distributor: 122


Quantity Unit Price Ext. Price
1 ₹ 6,299.42000 ₹ 6,299.42

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
1 ₹ 6,299.42000 ₹ 6,299.42

Stock:

Distributor: 110


Quantity Unit Price Ext. Price
60 ₹ 7,586.36000 ₹ 4,55,181.60
45 ₹ 7,624.63000 ₹ 3,43,108.35
30 ₹ 7,662.90000 ₹ 2,29,887.00
15 ₹ 7,701.17000 ₹ 1,15,517.55
10 ₹ 7,739.44000 ₹ 77,394.40
5 ₹ 7,778.60000 ₹ 38,893.00
1 ₹ 7,895.19000 ₹ 7,895.19

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
100 ₹ 7,814.26000 ₹ 7,81,426.00
1 ₹ 7,930.78000 ₹ 7,930.78

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 7,934.35000 ₹ 7,934.35

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line SmartFusion®
IC Encapsulation Type Tray
Availability Status Active
System Design Structure MCU, FPGA
Central CPU Unit ARM® Cortex®-M3
Non-Volatile Flash Memory 512KB
Random Access Memory Bytes 64KB
External Device Support DMA, POR, WDT
Interconnect Options EBI/EMI, Ethernet, I2C, SPI, UART/USART
Operational Speed Rating 80MHz
Key Feature Specifications ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Ambient Temp Range 0°C ~ 85°C (TJ)
Quality Grade Level -
Certification Qualification -
Component Housing Style 484-BGA
Vendor Package Type 484-FPBGA (23x23)

Description

Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by EBI/EMI, Ethernet, I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Indicates flash memory size evaluated at 512KB. Temperature range 0°C ~ 85°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 484-BGA that offers mechanical and thermal protection. Type of package 484-FPBGA (23x23) that preserves the integrity of the device. Support for external devices DMA, POR, WDT for system integration and improvement. Essential attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops detailing main features. Product status Active concerning availability and lifecycle. The total size of RAM 64KB for system or device specifications. Classification series for the product or component SmartFusion®. Operational speed 80MHz for mechanical or data tasks. Supplier package type 484-FPBGA (23x23) for component selection.