Stock:
Distributor: 140
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 5000 | ₹ 5,245.66000 | ₹ 2,62,28,300.00 |
| 1000 | ₹ 5,430.78000 | ₹ 54,30,780.00 |
| 500 | ₹ 8,406.05000 | ₹ 42,03,025.00 |
| 250 | ₹ 8,641.90000 | ₹ 21,60,475.00 |
| 50 | ₹ 8,892.88000 | ₹ 4,44,644.00 |
| 1 | ₹ 9,024.60000 | ₹ 9,024.60 |
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 60 | ₹ 7,617.51000 | ₹ 4,57,050.60 |
| 45 | ₹ 7,773.26000 | ₹ 3,49,796.70 |
| 30 | ₹ 11,045.79000 | ₹ 3,31,373.70 |
| 15 | ₹ 20,864.27000 | ₹ 3,12,964.05 |
Stock:
Distributor: 115
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 60 | ₹ 7,617.51000 | ₹ 4,57,050.60 |
| 45 | ₹ 7,773.26000 | ₹ 3,49,796.70 |
| 30 | ₹ 11,045.79000 | ₹ 3,31,373.70 |
| 15 | ₹ 20,864.27000 | ₹ 3,12,964.05 |
Stock:
Distributor: 116
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 480 | ₹ 7,670.69000 | ₹ 36,81,931.20 |
| 360 | ₹ 7,867.37000 | ₹ 28,32,253.20 |
| 240 | ₹ 8,074.41000 | ₹ 19,37,858.40 |
| 120 | ₹ 8,292.64000 | ₹ 9,95,116.80 |
| 60 | ₹ 8,766.50000 | ₹ 5,25,990.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 100 | ₹ 8,888.91000 | ₹ 8,88,891.00 |
| 1 | ₹ 9,020.54000 | ₹ 9,020.54 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 9,024.60000 | ₹ 9,024.60 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | SmartFusion® | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | ARM® Cortex®-M3 | |
| Non-Volatile Flash Memory | 512KB | |
| Random Access Memory Bytes | 64KB | |
| External Device Support | DMA, POR, WDT | |
| Interconnect Options | EBI/EMI, Ethernet, I2C, SPI, UART/USART | |
| Operational Speed Rating | 100MHz | |
| Key Feature Specifications | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
| Ambient Temp Range | 0°C ~ 85°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 484-BGA | |
| Vendor Package Type | 484-FPBGA (23x23) |
Description
Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by EBI/EMI, Ethernet, I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Indicates flash memory size evaluated at 512KB. Temperature range 0°C ~ 85°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 484-BGA that offers mechanical and thermal protection. Type of package 484-FPBGA (23x23) that preserves the integrity of the device. Support for external devices DMA, POR, WDT for system integration and improvement. Essential attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops detailing main features. Product status Active concerning availability and lifecycle. The total size of RAM 64KB for system or device specifications. Classification series for the product or component SmartFusion®. Operational speed 100MHz for mechanical or data tasks. Supplier package type 484-FPBGA (23x23) for component selection.
