Attribute
Description
Manufacturer Part Number
BCM55045B1IFSBG
Manufacturer
Description
10G XPON DPU CHIP
Manufacturer Lead Time
--
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 116
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2464 | ₹ 6,909.07000 | ₹ 1,70,23,948.48 |
| 1848 | ₹ 6,944.68000 | ₹ 1,28,33,768.64 |
| 1232 | ₹ 6,980.30000 | ₹ 85,99,729.60 |
| 616 | ₹ 7,015.91000 | ₹ 43,21,800.56 |
| 308 | ₹ 7,051.52000 | ₹ 21,71,868.16 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 308 | ₹ 7,119.55000 | ₹ 21,92,821.40 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 308 | ₹ 7,120.00000 | ₹ 21,92,960.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| System Design Structure | - | |
| Central CPU Unit | - | |
| Non-Volatile Flash Memory | - | |
| Random Access Memory Bytes | - | |
| External Device Support | - | |
| Interconnect Options | - | |
| Operational Speed Rating | - | |
| Key Feature Specifications | - | |
| Ambient Temp Range | - | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | - | |
| Vendor Package Type | - |
Description
Type of housing Tray for safeguarding or transporting components. Product status Active concerning availability and lifecycle.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD