Attribute
Description
Manufacturer Part Number
XCZU3CG-1SFVC784E
Manufacturer
Description
IC SOC CORTEX-A53 784FCBGA
Manufacturer Lead Time
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Stock:

Distributor: 116

Quantity Unit Price Ext. Price
1 ₹ 39,292.61000 ₹ 39,292.61

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
1 ₹ 42,905.40000 ₹ 42,905.40

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 42,923.81000 ₹ 42,923.81

Stock:

Distributor: 121


Quantity Unit Price Ext. Price
1 ₹ 44,195.58000 ₹ 44,195.58

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Zynq® UltraScale+™ MPSoC CG
IC Encapsulation Type Tray
Availability Status Active
System Design Structure MCU, FPGA
Central CPU Unit Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Non-Volatile Flash Memory -
Random Access Memory Bytes 256KB
External Device Support DMA, WDT
Interconnect Options CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operational Speed Rating 500MHz, 1.2GHz
Key Feature Specifications Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Ambient Temp Range 0°C ~ 100°C (TJ)
Quality Grade Level -
Certification Qualification -
Component Housing Style 784-BFBGA, FCBGA
Vendor Package Type 784-FCBGA (23x23)

Description

Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ for swift processing. Temperature range 0°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 784-BFBGA, FCBGA that offers mechanical and thermal protection. Type of package 784-FCBGA (23x23) that preserves the integrity of the device. Support for external devices DMA, WDT for system integration and improvement. Essential attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells detailing main features. Product status Active concerning availability and lifecycle. The total size of RAM 256KB for system or device specifications. Classification series for the product or component Zynq® UltraScale+™ MPSoC CG. Operational speed 500MHz, 1.2GHz for mechanical or data tasks. Supplier package type 784-FCBGA (23x23) for component selection.