Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Non-Volatile Flash Memory
-
Random Access Memory Bytes
256KB
External Device Support
DMA, WDT
Interconnect Options
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operational Speed Rating
500MHz, 1.2GHz
Key Feature Specifications
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Ambient Temp Range
-40°C ~ 100°C (TJ)
Quality Grade Level
-
Certification Qualification
-
Component Housing Style
530-WFBGA, FCBGA
Vendor Package Type
530-FCBGA (16x9.5)
Description
Utilizes a MPU, FPGA architecture to improve effectiveness. Presents connection choices defined by CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ for swift processing. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 530-WFBGA, FCBGA that offers mechanical and thermal protection. Type of package 530-FCBGA (16x9.5) that preserves the integrity of the device. Support for external devices DMA, WDT for system integration and improvement. Essential attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells detailing main features. Product status Active concerning availability and lifecycle. The total size of RAM 256KB for system or device specifications. Operational speed 500MHz, 1.2GHz for mechanical or data tasks. Supplier package type 530-FCBGA (16x9.5) for component selection.
Note :
GST will not be applied to orders shipping outside of India
