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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Stratix® 10 SX | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | |
| Non-Volatile Flash Memory | - | |
| Random Access Memory Bytes | 256KB | |
| External Device Support | DMA, WDT | |
| Interconnect Options | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Operational Speed Rating | 1.5GHz | |
| Key Feature Specifications | FPGA - 2500K Logic Elements | |
| Ambient Temp Range | -40°C ~ 100°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 2912-BBGA, FCBGA | |
| Vendor Package Type | 2912-FBGA, FC (55x55) |
Description
Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for swift processing. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 2912-BBGA, FCBGA that offers mechanical and thermal protection. Type of package 2912-FBGA, FC (55x55) that preserves the integrity of the device. Support for external devices DMA, WDT for system integration and improvement. Essential attributes FPGA - 2500K Logic Elements detailing main features. Product status Active concerning availability and lifecycle. The total size of RAM 256KB for system or device specifications. Classification series for the product or component Stratix® 10 SX. Operational speed 1.5GHz for mechanical or data tasks. Supplier package type 2912-FBGA, FC (55x55) for component selection.
