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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Arria 10 SX | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Non-Volatile Flash Memory | - | |
| Random Access Memory Bytes | 256KB | |
| External Device Support | DMA, POR, WDT | |
| Interconnect Options | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Operational Speed Rating | 1.5GHz | |
| Key Feature Specifications | FPGA - 660K Logic Elements | |
| Ambient Temp Range | -40°C ~ 100°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 1152-BBGA, FCBGA | |
| Vendor Package Type | 1152-FBGA, FC (35x35) |
Description
Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ for swift processing. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 1152-BBGA, FCBGA that offers mechanical and thermal protection. Type of package 1152-FBGA, FC (35x35) that preserves the integrity of the device. Support for external devices DMA, POR, WDT for system integration and improvement. Essential attributes FPGA - 660K Logic Elements detailing main features. Product status Obsolete concerning availability and lifecycle. The total size of RAM 256KB for system or device specifications. Classification series for the product or component Arria 10 SX. Operational speed 1.5GHz for mechanical or data tasks. Supplier package type 1152-FBGA, FC (35x35) for component selection.
