Attribute
Description
Manufacturer Part Number
MFS2303BMBA3EP
Manufacturer
Description
MFS2303BMBA3EP
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tray
Availability Status Active
Intended Uses System Basis Chip
Power Supply Amperage 40µA
Power Supply Voltage 5.5V ~ 40V
Ambient Temp Range -40°C ~ 125°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount, Wettable Flank
Component Housing Style 48-VFQFN Exposed Pad
Vendor Package Type 48-HVQFN (7x7)

Description

Perfectly designed for situations involving System Basis Chip. Employs supply current defined as 40µA. Mounting configuration Surface Mount, Wettable Flank for structural stability. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 48-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 48-HVQFN (7x7) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 48-HVQFN (7x7) for component selection. Voltage requirement 5.5V ~ 40V for electrical specifications. Voltage supply 5.5V ~ 40V for device operation.