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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Active | |
| Intended Uses | Audio | |
| Signal Mux/Demux Channels | 3:1 | |
| Circuit Switching Type | SP3T | |
| Audio/Video Channel Count | 2 | |
| Maximum On Resistance | 750mOhm | |
| Single Positive Supply | 1.8V ~ 5.5V | |
| Dual Symmetric Supply | - | |
| 3dB Bandwidth | - | |
| Key Product Highlights | Break-Before-Make, Clickless | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 14-WFDFN Exposed Pad | |
| Vendor Package Type | 14-TDFN (3x3) |
Description
Perfectly designed for situations involving Audio. Indicates 2 channels present for improved performance. Equipped with features categorized as Break-Before-Make, Clickless. Mounting configuration Surface Mount for structural stability. Mux/demux pathway 3:1 for signal control. Overall channels 2 for input/output or communication purposes. Resistance during the on-state 750mOhm for effective conduction. Peak resistance in the on-state 750mOhm for electrical efficiency. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 14-WFDFN Exposed Pad that offers mechanical and thermal protection. Type of package 14-TDFN (3x3) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 14-TDFN (3x3) for component selection. Circuit switch SP3T for functional operations. Single voltage supply for electronic devices at V+ 1.8V ~ 5.5V.
