Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH | |
| Total Memory Bytes | 64Mbit | |
| Storage Layout Structure | 8M x 8, 4M x 16 | |
| Data Access Bus | Parallel | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | 90ns | |
| Data Retrieval Speed | 90 ns | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 56-TFSOP (0.724", 18.40mm Width) | |
| Vendor Package Type | 56-TSOP |
Description
Provides data access speeds of 90 ns for effective data retrieval. Media format FLASH for data compatibility. Memory interface Parallel for performance and connectivity. Memory configuration 8M x 8, 4M x 16 for efficient data access. Total memory size 64Mbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 56-TFSOP (0.724", 18.40mm Width) that offers mechanical and thermal protection. Type of package 56-TSOP that preserves the integrity of the device. Supplier package type 56-TSOP for component selection. The primary technology platform FLASH linked to the product category. Duration required to write each word or page 90ns for memory components.
