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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | EEPROM | |
| Core Technology Platform | EEPROM | |
| Total Memory Bytes | 1Mbit | |
| Storage Layout Structure | 128K x 8 | |
| Data Access Bus | Parallel | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | 10ms | |
| Data Retrieval Speed | 120 ns | |
| Power Supply Voltage | 4.5V ~ 5.5V | |
| Ambient Temp Range | -55°C ~ 125°C (TC) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 32-CFlatPack | |
| Vendor Package Type | 32-FlatPack, Ceramic Bottom-Brazed |
Description
Provides data access speeds of 120 ns for effective data retrieval. Media format EEPROM for data compatibility. Memory interface Parallel for performance and connectivity. Memory configuration 128K x 8 for efficient data access. Total memory size 1Mbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -55°C ~ 125°C (TC) for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 32-CFlatPack that offers mechanical and thermal protection. Type of package 32-FlatPack, Ceramic Bottom-Brazed that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 32-FlatPack, Ceramic Bottom-Brazed for component selection. Voltage requirement 4.5V ~ 5.5V for electrical specifications. The primary technology platform EEPROM linked to the product category. Voltage supply 4.5V ~ 5.5V for device operation. Duration required to write each word or page 10ms for memory components.