Attribute
Description
Manufacturer Part Number
UFS128-CY14-02N01
Description
UFS 3.1 G4 2L 153B 128GB -25c to
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
250 ₹ 3,479.16000 ₹ 8,69,790.00
100 ₹ 3,599.58000 ₹ 3,59,958.00
50 ₹ 3,692.59000 ₹ 1,84,629.50
30 ₹ 3,762.00000 ₹ 1,12,860.00
10 ₹ 3,913.15000 ₹ 39,131.50
1 ₹ 4,233.73000 ₹ 4,233.73

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 3,977.41000 ₹ 3,977.41
10 ₹ 3,380.22000 ₹ 33,802.20
50 ₹ 3,331.27000 ₹ 1,66,563.50
100 ₹ 3,247.61000 ₹ 3,24,761.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
RAM Technology Category Non-Volatile
Storage Media Type FLASH
Core Technology Platform FLASH - NAND (TLC)
Total Memory Bytes 1Tbit
Storage Layout Structure 128G x 8
Data Access Bus UFS 3.1
Timing Pulse Rate 26 MHz
Memory Write Speed Word/Page -
Data Retrieval Speed -
Power Supply Voltage 2.4V ~ 2.7V
Ambient Temp Range -25°C ~ 85°C
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 153-VFBGA
Vendor Package Type 153-FBGA (11.5x13)

Description

Operates at a clock frequency of 26 MHz. Media format FLASH for data compatibility. Memory interface UFS 3.1 for performance and connectivity. Memory configuration 128G x 8 for efficient data access. Total memory size 1Tbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 153-VFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 153-FBGA (11.5x13) for component selection. Voltage requirement 2.4V ~ 2.7V for electrical specifications. The primary technology platform FLASH - NAND (TLC) linked to the product category. Voltage supply 2.4V ~ 2.7V for device operation.