Attribute
Description
Manufacturer Part Number
EMMC64G-TY29-5B111
Description
IC FLASH 512GBIT EMMC 153WFBGA
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
500 ₹ 1,587.14000 ₹ 7,93,570.00
250 ₹ 1,628.49000 ₹ 4,07,122.50
100 ₹ 1,684.25000 ₹ 1,68,425.00
50 ₹ 1,727.12000 ₹ 86,356.00
25 ₹ 1,770.39000 ₹ 44,259.75
10 ₹ 1,828.06000 ₹ 18,280.60
1 ₹ 1,973.13000 ₹ 1,973.13

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 1,776.44000 ₹ 1,776.44
10 ₹ 1,646.50000 ₹ 16,465.00
25 ₹ 1,610.01000 ₹ 40,250.25
50 ₹ 1,569.96000 ₹ 78,498.00
100 ₹ 1,500.54000 ₹ 1,50,054.00
250 ₹ 1,462.27000 ₹ 3,65,567.50

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tray
Availability Status Active
RAM Technology Category Non-Volatile
Storage Media Type FLASH
Core Technology Platform FLASH - NAND (TLC)
Total Memory Bytes 512Gbit
Storage Layout Structure 64G x 8
Data Access Bus eMMC
Timing Pulse Rate -
Memory Write Speed Word/Page -
Data Retrieval Speed -
Power Supply Voltage 1.8V, 3.3V
Ambient Temp Range -25°C ~ 85°C
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 153-WFBGA
Vendor Package Type 153-FBGA (11.5x13)

Description

Media format FLASH for data compatibility. Memory interface eMMC for performance and connectivity. Memory configuration 64G x 8 for efficient data access. Total memory size 512Gbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-WFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 153-FBGA (11.5x13) for component selection. Voltage requirement 1.8V, 3.3V for electrical specifications. The primary technology platform FLASH - NAND (TLC) linked to the product category. Voltage supply 1.8V, 3.3V for device operation.